Fexingo
The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations
Lucas and Luna sit down at a lab bench cluttered with oscilloscopes and prototype boards to talk about the engineering decisions that shape the chips powering modern life. Each episode takes one piece of hardware — a new RISC-V core, a GaN power amplifier, a MEMS accelerometer — and examines its design trade-offs, yield challenges, and market positioning. They discuss why Intel’s 20A node matters for foundry customers, how TSMC’s CoWoS packaging affects AI accelerator supply, and what the CHIPS Act subsidies mean for domestic fab construction. Lucas brings the component-level knowledge (threshold voltages, die sizes, lithography steps); Luna pushes on the system-level implications (thermal constraints, software compatibility, supply chain risk). The listener is someone who reads datasheets for fun, follows EDA tool announcements, or needs to decide between an FPGA and an ASIC for their next product. No hot takes on Apple’s latest chip — just a careful look at what the die shot reveals and whether the architecture will trickle down to mid-range devices. Can a country really onshore advanced semiconductor manufacturing in a decade? How do you test a chip with billions of transistors? And what does the shift to chiplets mean for the engineer designing a PCB today? #SemiconductorIndustry #ChipDesign #HardwareEngineering #Electronics #TSMC #Intel #RISCV #GaN #MEMS #EDA #ASIC #FPGA #CHIPSAct #DieShot #EngineeringConversations #Technology #FexingoBusiness #BusinessPodcast Keep every episode free: buymeacoffee.com/fexingo
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